With the continuous expansion of production capacity in domestic consumer electronics, semiconductor packaging, new power batteries and other fields, electrostatic protection has become a core control point that cannot be ignored in the precision manufacturing process. Recently, the large-scale application of anti-static PE film in multiple segmented manufacturing scenarios is gradually replacing traditional scattered electrostatic protection methods, providing support for the stable performance of electronic products throughout the entire production, turnover, and transportation chain. In actual testing scenarios, the defect rate of components caused by electrostatic discharge can be reduced by more than 90%.

In the 3C electronics and semiconductor manufacturing scene, anti-static PE film has become a standard protective material for sensitive components such as wafers, IC chips, printed circuit boards, camera modules, etc. In the past, many companies relied solely on static grounding facilities on workshop floors and workbenches, which could not solve the problem of friction and electrification during the transportation of materials in turnover boxes and cross workshop circulation. Slight static discharge could cause internal circuit breakdown of chips and hidden damage to circuit boards, ultimately leading to functional failure of products in the later stage. Now, by attaching customized anti-static PE film to the surface of the turnover tray and coating bare boards and semi-finished components with a single film, not only can the accumulated charges on the surface of the components be quickly dissipated, but also the dust in the environment can be prevented from adsorbing on the pins and pads of the components, greatly reducing the probability of virtual soldering in the SMT surface mount process. Part of the head panel factories use high transparency and anti-static PE film to temporarily cover the semi-finished screen body on the OLED screen module production line, which not only avoids small particles adsorbed by static electricity from scratching the display layer, but also does not affect workers' visual inspection of product appearance defects.

In the fields of communication and computer hardware manufacturing, the application of anti-static PE film has extended to the details of the entire production process. During the production process of coaxial cables, anti-static PE film is immediately used for temporary covering after the insulation layer is extruded, which can prevent the cable surface from rubbing and breaking through the partially cured insulation layer, greatly reducing the failure rate of the voltage withstand test of the finished cable; The dedicated low precipitation anti-static PE film in the assembly process of the magnetic head and disc of the hard disk drive will not leave residue on the high-precision metal surface, and can also prevent small debris adsorbed by static electricity from entering the disc cavity during the assembly process, thereby improving the long-term stability of the hard disk operation from a protective perspective.

From industry feedback, it can be seen that in the past, many manufacturing companies' understanding of electrostatic protection was only limited to single point equipment modification. Nowadays, more and more factories are beginning to incorporate anti-static PE film as a core component of the full chain electrostatic protection system. By customizing film materials with corresponding thickness, viscosity, and anti-static levels for different processes, enterprises can quickly implement the full process electrostatic protection upgrade without the need for large-scale transformation of existing production lines. This achieves a significant improvement in the overall yield rate of electronic products without significantly increasing consumable costs. The industry expects that the penetration rate of anti-static PE film in high-end manufacturing scenarios will continue to increase in the next two years, and more customized scene specific products will be gradually implemented.