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Observation of the anti-static bag industry: technological transition from basic protection to intel

1、 Technological evolution:
First generation (1980s): Single layer PE with anti-static agent added, surface resistance of 10-10 Ω
Second generation (2010s): PET/AL/CPP three-layer composite structure, with a shielding effectiveness of 30dB
2、 Core performance breakthrough
According to the testing data in 2025, the performance of mainstream products has achieved a leapfrog improvement:
The national standard for indicators requires testing methods for the level of top enterprises
Surface resistance ≤ 10 Ω 10-10 Ω IEC 61340-5-1
Shielding effectiveness ≥ 30dB 60dB@1GHz MIL-STD-285
Static decay time ≤ 2.0 seconds 0.05 seconds ANSI/ESD STM11.11
3、 Application scenario expansion
1. Semiconductor packaging and testing: 3D NAND chips are transported using vacuum anti-static aluminum foil bags, resulting in a 2.3 percentage point increase in yield rate
2. Power Battery: Companies such as CATL will use four layer composite bags for shipping 4680 battery modules, which have passed UN38.3 certification
3. Space Economy: Commercial satellite companies use gold-plated polyimide bags that can withstand extreme environments ranging from -196 ℃ to 300 ℃

4、 New market trends
Green Transformation: A bio based anti-static film developed by a manufacturer in Zhejiang Province reduces carbon emissions by 37% (certified by T Ü V Rheinland)
Intelligent packaging: Shenzhen enterprises integrate NFC chips into anti-static bags, which can monitor transportation temperature, humidity, and static electricity risks in real time
Military civilian integration: Aerospace Science and Industry Corporation's demand has surged, and the purchase volume of special anti-static bags has increased by 68% year-on-year.